High-purity copper plates play a multifaceted role in the aerospace industry, primarily serving as materials for surface treatment and key substances for the manufacturing of electronic components. They help ensure the quality and reliability of aerospace components, enhance the performance and safety of aircraft, and extend their service life.

High-purity copper plates play an indispensable role in the nuclear power industry, primarily reflected in the surface treatment of nuclear power equipment, certain chemical reactions in the nuclear fuel cycle, and the manufacturing of electronic components. They are essential for enhancing the corrosion resistance of nuclear power equipment, ensuring the accuracy of inspections, optimizing the processing of nuclear fuel, and guaranteeing the performance of electronic components.

High-purity copper plates possess excellent physical and chemical properties, making them an ideal choice for many high-performance applications. From thin film deposition, ion implantation, laser deposition to nuclear physics experiments and medical device manufacturing, high-purity copper targets play an indispensable role in advancing scientific progress and industrial development.

High-purity copper plates are used for circuit connections and heat dissipation systems of superconducting magnets to ensure the stable operation of superconductors at low temperatures and strong magnetic fields. High-purity copper plate provides a low-resistance path, reduces heat accumulation, and maintains the stability of the superconducting state. It greatly improves the RRR value of superconducting materials and cables: 3000-4000.

High-purity soluble anodes are primarily used in industrial-grade electroplating and PCB electroplating sectors, characterized by their high electrolytic efficiency, superior quality of plated structures, and reduced frequency of equipment maintenance.

High-purity silver-free copper anodes are widely used in advanced packaging and semiconductor electroplating applications, characterized by their high purity, excellent electrical conductivity, and silver-free composition to prevent metallic contamination.

High-purity copper sulfate is mainly used in the electroplating process in the semiconductor manufacturing process, and its purity and stability are crucial to chip performance. In integrated circuits, as the process size continues to shrink, a large number of micro-vias and grooves are required inside the chip to achieve electrical signal interconnection between different layers. High-purity copper sulfate deposits copper precisely in these extremely small and complex structures by electroplating, which can not only achieve uniform filling in the vertical direction, but also effectively avoid plating defects such as voids or bubbles, thereby forming high-quality copper interconnects.

High-purity copper sulfate, as a core material in the electroplating process of integrated circuits, enables circuit connections and enhances current-carrying capacity. In electroless copper plating, it serves as a source of copper ions to facilitate metallization. Additionally, by combining with specific additives, it improves the performance of the copper layer, ensures the smooth progression of subsequent manufacturing steps, and enhances the stability and reliability of integrated circuits under diverse operating environments.

High-purity copper sulfate is mainly used in the metallization process of solar cells and the manufacture of photovoltaic modules in the photovoltaic industry. In solar cell manufacturing, copper electroplating technology uses high-purity copper sulfate to improve conductivity, reduce costs and enhance reliability. In the manufacturing of photovoltaic modules, copper sulfate can be used for surface treatment of components such as frames and junction boxes to improve corrosion resistance and conductivity.

High-purity copper foil demonstrates significant advantages in the field of electromagnetic shielding due to its high electrical conductivity, excellent thermal conductivity, good electromagnetic interference resistance, corrosion resistance, flexibility, and processability.

High-purity copper foil can be applied in high-frequency circuits for transmission and connection devices due to its low resistance and high conductivity, which effectively reduce signal loss and interference caused by the skin effect . This ensures the integrity and purity of high-frequency signal transmission , thereby enhancing the performance and coverage of communication equipment, especially in 5G applications.

High-purity copper foil, as a critical material, is widely used in electrode fabrication and surface treatment fields, particularly playing a vital role in the production of lithium-ion battery electrode materials. Thanks to its superior material properties, high-efficiency energy conversion capabilities, and exceptional stability and reliability, high-purity copper foil demonstrates significant advantages in the new energy sector, making it highly favored by the industry.

High-purity copper foil, as a critical material in electronic circuit manufacturing, ensures stable operation of electronic devices under high-precision requirements through its exceptional conductive properties. Its ultra-high purity characteristics not only effectively reduce conductive resistance and signal transmission interference but also significantly enhance image display clarity and the reliability of monitoring data