English
| • Packaging specifications: | |
|---|---|
| Quantity: | |
Basic parameters :
Total amount of metal impurities: | ＜5ppm |
| Copper ion concentration: | ~10g/L |
| Sulfuric acid concentration: | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Light blue liquid |
Product application industry:
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
Features:
It is produced using high-quality raw materials, with high copper ion purity and very few impurities, ensuring that the solution is stable and efficient during the electroplating process.
Copper ion concentration of 10g/L is suitable for most conventional electroplating processes, especially in applications requiring medium deposition rates and high coating quality.
The copper layer is uniformly deposited, has a high surface finish and adhesion, and is suitable for electroplating of precision equipment.
The products comply with international environmental standards, are free of harmful chemicals, are safe and environmentally friendly to use, and are suitable for the electroplating needs of all industries.
Basic parameters :
Total amount of metal impurities: | ＜5ppm |
| Copper ion concentration: | ~10g/L |
| Sulfuric acid concentration: | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Light blue liquid |
Product application industry:
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
Features:
It is produced using high-quality raw materials, with high copper ion purity and very few impurities, ensuring that the solution is stable and efficient during the electroplating process.
Copper ion concentration of 10g/L is suitable for most conventional electroplating processes, especially in applications requiring medium deposition rates and high coating quality.
The copper layer is uniformly deposited, has a high surface finish and adhesion, and is suitable for electroplating of precision equipment.
The products comply with international environmental standards, are free of harmful chemicals, are safe and environmentally friendly to use, and are suitable for the electroplating needs of all industries.
