English
| • Packaging specifications: | |
|---|---|
| Quantity: | |
Basic parameters:
| Total amount of metal impurities: | ＜5ppm |
| Copper ion concentration: | ~5g/L |
| Sulfuric acid concentration : | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Light blue liquid |
Product application industry:
During the MEMS manufacturing process, high purity copper sulfate solution provides uniformity, high purity and stability of the copper electroplating layer by finely controlling each step of the electroplating process. These advantages are reflected in every step from surface preparation to electroplating deposition to post-treatment and etching processes. By optimizing these processes, high-purity copper sulfate solution not only improves the electrical performance, mechanical strength and reliability of MEMS devices, but also improves production efficiency, reduces production defects, and ultimately ensures high quality and consistency of the product.
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
Features:
The copper layer has uniform thickness, strong adhesion and smooth surface, meeting the needs of precision plating and high quality.
Because the copper ion concentration is low, the deposition rate during the plating process can be better controlled, making the thickness of the copper plating layer easier to control.
Suitable for electroplating operations at lower temperatures, ensuring that the electroplating layer is not affected by high temperatures, and is suitable for fine electroplating processes.
Basic parameters:
| Total amount of metal impurities: | ＜5ppm |
| Copper ion concentration: | ~5g/L |
| Sulfuric acid concentration : | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Light blue liquid |
Product application industry:
During the MEMS manufacturing process, high purity copper sulfate solution provides uniformity, high purity and stability of the copper electroplating layer by finely controlling each step of the electroplating process. These advantages are reflected in every step from surface preparation to electroplating deposition to post-treatment and etching processes. By optimizing these processes, high-purity copper sulfate solution not only improves the electrical performance, mechanical strength and reliability of MEMS devices, but also improves production efficiency, reduces production defects, and ultimately ensures high quality and consistency of the product.
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
Features:
The copper layer has uniform thickness, strong adhesion and smooth surface, meeting the needs of precision plating and high quality.
Because the copper ion concentration is low, the deposition rate during the plating process can be better controlled, making the thickness of the copper plating layer easier to control.
Suitable for electroplating operations at lower temperatures, ensuring that the electroplating layer is not affected by high temperatures, and is suitable for fine electroplating processes.
