English
| • Packaging specifications: | |
|---|---|
| Quantity: | |
Basic parameters:
Total amount of metal impurities: | ＜10ppm |
| Copper ion concentration: | ~60g/L |
| Sulfuric acid concentration: | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Dark blue liquid |
Product application industry:
The application of high-purity copper sulfate solution in precision device electroplating has significant advantages, especially in terms of purity, uniformity, mechanical properties and electrical properties of the electroplating layer, which can meet the requirements of high-precision devices. By controlling parameters such as current density, solution concentration, temperature, etc., precision electroplating can be achieved in micron-level or even nano-level structures, and is widely used in microelectronics, sensors and other fields.
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
The application of high-purity copper sulfate solution in photovoltaic cell manufacturing is mainly concentrated in the copper plating process of the back surface and front electrode of the battery, especially in the formation of copper contact electrodes of the back electrode of the photovoltaic cell. Copper electroplating technology provides photovoltaic cells with low cost, high conductivity, excellent mechanical strength electrode materials, which helps to improve the overall efficiency and reliability of the battery. Electroplating through high-purity copper sulfate solution can not only accurately control the thickness and quality of the copper plating layer, but also improve the photoelectric conversion efficiency and service life of photovoltaic cells.
Features:
This product uses high-quality high-purity copper sulfate as raw material, and is carefully filtration and processing to ensure the purity of copper ions and the stability of solution, greatly reducing the content of impurities.
The copper ion concentration of 60 g/L makes this solution have a higher deposition rate and is suitable for electroplating processes that require thicker copper layers or high production efficiency.
It can provide a relatively uniform and dense copper coating, with a faster deposition speed, significantly improve production efficiency and ensure the quality of the copper layer.
Comply with international environmental standards such as ROHS and REACH, non-toxic and harmless, and is safe for the human body and the environment when used.
Basic parameters:
Total amount of metal impurities: | ＜10ppm |
| Copper ion concentration: | ~60g/L |
| Sulfuric acid concentration: | Can be configured according to customer requirements |
| Chloride ion concentration: | Can be configured according to customer requirements |
| Appearance: | Dark blue liquid |
Product application industry:
The application of high-purity copper sulfate solution in precision device electroplating has significant advantages, especially in terms of purity, uniformity, mechanical properties and electrical properties of the electroplating layer, which can meet the requirements of high-precision devices. By controlling parameters such as current density, solution concentration, temperature, etc., precision electroplating can be achieved in micron-level or even nano-level structures, and is widely used in microelectronics, sensors and other fields.
The application of high-purity copper sulfate solution in integrated circuits is mainly concentrated in the electroplating process of copper interconnects, providing a high-quality, uniform and stable copper plating layer. Its advantages include providing a high-purity copper layer, ensuring uniform deposition of the copper layer, improving conductivity, reducing product defects and improving long-term stability and reliability of the product. By precisely controlling process parameters, it can meet the high requirements of modern integrated circuits for accuracy and performance, ensuring the production of high-quality IC products.
The application of high-purity copper sulfate solution in semiconductor wafer manufacturing not only promotes the development of copper interconnection technology, but also improves the electrical performance and stability of the chip. With the trend of the semiconductor industry constantly pursuing higher integration and smaller sizes, the advantages of copper as an interconnecting material are becoming increasingly obvious. Especially under the manufacturing requirements of micro and nano-grade manufacturing, high-purity copper sulfate solutions can provide stable and High quality electroplating layer.
The application of high-purity copper sulfate solution in photovoltaic cell manufacturing is mainly concentrated in the copper plating process of the back surface and front electrode of the battery, especially in the formation of copper contact electrodes of the back electrode of the photovoltaic cell. Copper electroplating technology provides photovoltaic cells with low cost, high conductivity, excellent mechanical strength electrode materials, which helps to improve the overall efficiency and reliability of the battery. Electroplating through high-purity copper sulfate solution can not only accurately control the thickness and quality of the copper plating layer, but also improve the photoelectric conversion efficiency and service life of photovoltaic cells.
Features:
This product uses high-quality high-purity copper sulfate as raw material, and is carefully filtration and processing to ensure the purity of copper ions and the stability of solution, greatly reducing the content of impurities.
The copper ion concentration of 60 g/L makes this solution have a higher deposition rate and is suitable for electroplating processes that require thicker copper layers or high production efficiency.
It can provide a relatively uniform and dense copper coating, with a faster deposition speed, significantly improve production efficiency and ensure the quality of the copper layer.
Comply with international environmental standards such as ROHS and REACH, non-toxic and harmless, and is safe for the human body and the environment when used.
